Flip-Chip Pressure Sensor Dies

You Can Do More with A Single Sensor Die

BCM SENSOR has recently released a newly developed flip-chip pressure sensor die for mass production. This flip-chip sensor die, model SE105, is based on piezoresistive working principle and is manufactured by 6” silicon micro-machining process.

Thanks to the flip-chip structure which has been realized at the SE105 pressure sensor die via MEMS manufacturing process, the flip-chip pressure sensor die SE105 possesses the following advantages comparing to the conventional-structure of pressure sensor dies:

• Improved resistance to harsh environment: both corrosive and conductive pressure medium can have direct contact with the upper surface of the sensor fSE105 sensor dies as there is no Wheatstone bridge circuit on the upper surface;

• No need to use non-stress protective gel as the protection on the upper surface of pressure sensor dies, because the pressure medium can have direct contact to the pressure diaphragm or silicon membrane as indicated in the drawing above;

• Two bonding processes, i.e., the die bonding and wire bonding processes, are combined and simplified to one bonding process in sensor manufacturing via SMT by using SE105.

The SE105 flip-chip pressure sensor die also features an outstanding non-linearity of 0.2%fs and an excellent long-term stability of 0.1%fs/year.

For more details about SE105 flip-chip pressure sensor die, please visit BCM SENSOR website: http://www.bcmsensor.com/products/pressure-sensor-dies/model-se105-sensor-dies-for-flow-meter-application/

You can also contact us by emailing sales@bcmsensor.com or by calling +32-3-238 6469.

Flip-Chip Pressure Sensor Dies SE105