Kulicke & Soffa company News and Trends items

As features and functionalities of ICs increases, driving higher I/Os, the trend for flip chip is moving towards pitches less than 100 μm needing higher accuracy flip chip bonding and alternative interconnect solutions. Designed with performance and accuracy in mind, K&S APAMATM solutions provide higher accuracy and lower pitch bonding with market leading throughput. Th...

As features and functionalities of ICs increases, driving higher I/Os, the trend for flip chip is moving towards pitches less than 100 μm needing higher accuracy flip chip bonding and alternative interconnect solutions. Designed with performance and accuracy in mind, K&S APAMATM solutions provide higher accuracy and lower pitch bonding with market leading throughput. Th...