Master Bond company News and Trends items

Master Bond EP30TC is a two component epoxy that contains a robust thermally conductive filler with very fine particle sizes. This NASA low outgassing certified system can be used for bonding, coating, sealing and encapsulating for the aerospace, electronic, optical and OEM industries. EP30TC exhibits a thermal conductivity of 18-20 BTU•in/ft2•hr•°F [2.60-2.88 W/(m•K)] ...

Master Bond EP3HTND-2Med Black is a high strength, fast curing epoxy for use in the assembly of medical devices. It fully meets USP Class VI specifications. This one part system delivers superior resistance to a variety of sterilization methods such as chemical sterilants, EtO, radiation and especially autoclaving. As a one component system, EP3HTND-2Med Black does no...

Master Bond X5TC is an elastomeric system that has a thermal conductivity of 10-12 BTU•in/ft2•hr•°F [1.44-1.73 W/m•K] while maintaining solid electrical insulation properties. This one part, no mix adhesive/sealant has a paste-like consistency and is very easy to use. It readily cures in 8-12 hours at room temperature or in 60-90 minutes at 150°F. X5TC bonds well to man...

This two part system is optically clear with a refractive index of 1.55. It also passes ASTM E595 testing to meet NASA low outgassing specifications. Beyond its optical properties, EP30-2LB is a reliable structural adhesive with a tensile lap shear strength of 3,000-3,200 psi and a compressive strength of 14,000-15,000 psi. It bonds well to a wide variety of substrates...

This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)] and a volume resistivity exceeding 1014 ohm-cm. EP3UF also passes NASA low outgassing tests and can be used for bonding and underfills in microelectronics packaging/assembly application...

It is a toughened system and is capable of withstanding rigorous thermal cycling, mechanical vibration and shock. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for the aerospace, electronic and specialty OEM industries including use in vacuum and clean room environments.

Supreme 3HTND-2CCM has a paste consistency that flows slightly while curing. It cures readily at elevated temperatures. The minimum curing schedule is 20-30 minutes at 250°F or 5-10 minutes at 300°F. This is a filled system with low shrinkage upon curing and sound dimensional stability. It bonds well to a wide variety of substrates used in electronics including metals, c...

Master Bond UV22DC80 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating with the ability to cure under UV light and/or with heat. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 milliwatts/cm2 of energy. This type of formulation allows for polymerization in “shado...

Featuring convenient processing, this epoxy has a forgiving 100 to 50 mix ratio by weight and a pot life of 7-9 hours at room temperature for a 100 gram mass. Upon curing, EP29LPAO exhibits low exotherm, even in large volumes. This dimensionally stable formulation has low shrinkage upon cure, both linearly and volumetrically. EP29LPAO delivers a thermal conductivity of ...

UV15X-6NM-2 features an elongation exceeding 200%, which contributes to its ability to withstand rigorous thermal cycling and mechanical shocks. It is serviceable over the wide temperature range of -80°F to +250°F. It also has very good chemical resistance, especially to water, cleaning agents and oils. With a refractive index of 1.50, this compound is optically clear an...

Unlike typical one part epoxies, EP3RR-80 will cure in 45-50 minutes at 80°C (175°F), or in 25-30 minutes at 250°F. It features low exotherm while curing enabling it to cure in thicker sections up to and beyond a 1/2 inch deep. This dimensionally stable compound forms high strength bonds to metals, composites, ceramics, glass and many plastics. EP3RR-80 has superb el...

This two component epoxy system withstands a variety of sterilization methods, including EtO, radiation and many cold sterilants. EP21AOLV-2Med is thermally conductive and electrically isolating with a smooth consistency and good flow properties. It bonds well to metals, composites, glass, ceramics, plastics and many rubber materials. This dimensionally system offers a h...

As a toughened epoxy, Supreme 12AOHT-LO resists rigorous thermal cycling and shocks over the wide service temperature range of 4K to +500°F. It offers high thermal conductivity of 9-10 BTU•in/ft2•hr•°F and is a competent electrical insulator. It bonds well to an array of substrates including metals, composites, glass, rubbers, ceramics and many plastics. This compound...

Master Bond MasterSil 972TC-LO passes the rigorous requirements for low outgassing per ASTM E595 specifications. It is particularly well suited for use in vacuum environments as well as applications in the aerospace, electronic, opto-electronic and specialty OEM industries. This two part silicone system offers convenient handling for bonding, sealing, coating and potting...

Supreme 45HTQ-4 has the unique combination of exceptional chemical, temperature and abrasion resistance. Serviceable from -100°F to +450°F, it is capable of withstanding rigorous thermal cycling. This compound offers high tensile lap shear, compressive and tensile strength of 1,400-1,600 psi, 24,000-26,000 psi and 8,000-9,000 psi, respectively. Supreme 45HTQ-4 also retai...

Supreme 18TC maintains high bond strength properties even when exposed to hostile environmental conditions, including high/low temperatures. It bonds well to a wide variety of substrates including metals, composites, ceramics and plastics. This compound offers a tensile lap shear strength of 2,200-2,400 psi, a tensile strength of 6,000-7,000 psi, a t-peel strength of 5-1...

Supreme 11HTLP is formulated to have impressive toughness, which imparts high bond strength of over 3,200 psi and 20 pli, respectively in the shear and peel mode. This compound bonds well to a wide variety of substrates, including metals, glass, ceramics, composites, rubbers and plastics. Its toughness also allows it to withstand aggressive thermal cycling as well as imp...

Formulated for demanding applications in the medical industry, UV15DC80Med passes stringent USP Class VI tests for biocompatibility as well as ISO 10993-5 cytotoxicity standards. This one part no mix compound is capable of withstanding many chemicals including liquid steriliants, radiation and even steam in the form of autoclaving. The heat curing portion of UV15DC80M...

This single component system has a moderate, flowable viscosity and a solid electrical profile, which makes it well suited for conformal coating applications in the electronic and optical industries. Featuring a soft durometer of 25-35 Shore A, this low stress silicone can protect sensitive electronic components. As a one part system, MasterSil 920-LO offers convenien...

This moderate viscosity compound has good flow properties and can be cast in sections up to ½ inch thick. EP17HT-100 is not premixed and frozen and has an unlimited working life at room temperature. It is a reliable electrical insulator offering a volume resistivity of >1015 ohm-cm. This dimensionally stable system bonds well to metals, composites, ceramics, glass and ma...

This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries. Featuring a silver filler, EP3HTS-LO is electrically conductive with a low volume resistivity of less than 0.001 ohm-cm. It also has a thermal conductivity of 12-15 BTU•in/(ft²•hr•°F) [1.73-2.16 W/(m•K)]. EP3HT...

As a silicone, MasterSil 910Med delivers high flexibility and has an elongation of 400-600%. This imparts reliable thermal cycling and mechanical shock resistance. Bond strength to metals, composites, glass ceramics, rubbers, plastics and other silicone substrates is excellent. It is serviceable over the broad temperature range of -75°F to +400°F. It is also a competent ...

Featuring an ultra low mixed viscosity of 80-140 cps, EP113 can be readily mixed using a 100 to 80 ratio by weight. It has a long working life of 2-3 days for a 100 gram batch. It should be noted that EP113 requires oven curing. Its low viscosity combined with its superb electrical insulation profile makes this product well suited for potting, encapsulating, coating and ...

EP21NDCL offers convenient handling with a one to one mix ratio by weight or volume. This ratio can be adjusted to deliver different properties. For example, a two to one mix ratio cures more rigid, while a one to two mix ratio produces a flexible system. EP21NDCL cures at room temperatures or more quickly at elevated temperatures. Upon curing, this epoxy features du...