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One Component, High Temperature Resistant Epoxy Offers a Low Coefficient of Thermal Expansion

MASTER BOND INC
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Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications.

EP13LTE cures readily in 1-2 hours at 300-350°F. This epoxy paste has limited flow while curing. It bonds well to many substrates such as metals, glass, composites, ceramics and plastics. Once cured, EP13LTE has an impressive strength profile delivering a tensile lap shear strength of 2,600-2,800 psi, a compressive strength of 24,000-26,000 psi and a tensile modulus of 500,000-550,000 psi. This dimensionally stable system is able to withstand 1,000 hours at 85°C/85% RH and maintain a Shore D hardness of 90.

One Component, High Temperature Resistant Epoxy Offers a Low Coefficient of Thermal Expansion

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