Sensors Expo 2018: Turn-Key Solutions For MEMS Sensors

SMART Microsystems has the ways, means, and flexible equipment capabilities to create a turn-key solution for microelectronic package assembly of MEMS sensors. The company can help reduce total costs from prototyping through market entry.

Prototype development and manufacturing capabilities include dicing, die attach/flip chip, vacuum solder reflow, wire bonding, and encapsulation. Their environmental life testing identifies reliability issues early in MEMS sensor product development. Additionally, the company can build early proof-of-concept samples as well as feasibility studies to help avoid challenges that appear early in process development.

In brief, SMART Microsystems creates turn-key solutions for microelectronic package assembly challenges to move MEMS sensor technology from development to production. With an engineering team experienced in manufacturing and state-of-the-art facilities, SMART Microsystems accelerates the transition of new MEMS sensor products to market, providing the lowest overall development time and cost to satisfy full life cycle requirements.