Full-Bridge Semiconducter Strain Gauges
FD101 piezoresistive sensor die is designed for force measurements universally. For example, if one of such the sensor dies is bonded on a bending beam, it forms a half bridge measuring circuit, or if two of such the sensor dies are bonded on the top- and bottom-surface of the bending beam respectively, they form a full bridge measuring circuit.
In case of an either tension or compression beam where this sensor die is bonded on, it can form a full bridge measuring circuit. In addition, if this sensor die is bonded on a shear beam or torsion beam, it can also form a full bridge circuit to measure shear force or torque.
Compared to conventional metal foil strain gauges and semiconductor strain gauges, this FD101 sensor die offers some unique benefits as follows:
- small footprint of only 1.3mm x 1.3mm,
- high bridge resistance of 2.4kΩ, and
- output sensitivity ≥29 mV/V.
Thanks to MEMS technology, the FD101 sensor die is a cost-effective solution for a high-volume application.
The dimensions and specifications can be found on the datasheet of FD101 as linked below:
For further information, please contact BCM SENSOR at firstname.lastname@example.org or +32-3-238 6469.