Conprofe @SIMTOS 2024 Successfully Ends in Korea!

Conprofe Ultrasonic Integrated High-Efficiency Machining Solution gained a lot of attentions and attracted end users in semiconductor industry and strategic partners to sign cooperation agreement on site!

On April 5, SIMTOS 2024 with over 1,300 global companies exhibited ended successfully. Conprofe showcased Ultrasonic Integrated High-Efficiency Machining Solution and Innovative Products including Ultrasonic CNC Machine Tools, Ultrasonic Technology, Green Technology, Precision Tool Holders and Super-Hard Tools, appealing for high attention from customers to visit the booth, negotiate and interact together!

Site Photos

Experiencing the High-Frequency Vibration by Ultrasonic Machining System

Deal Reached on Site

Conprofe continuously contributes to semiconductor component machining with Ultrasonic Machine Tools for better performance

At SIMTOS 2024, Conprofe presented the high-efficiency machining solutions of ultrasonic machine tools in semiconductor industry, effectively breaking through the ultra-deep micro-hole machining problems of hard-brittle materials. The outstanding machining benefits indeed impressed many visitors.

Good News: Conprofe had deep communication with South Korean end user in semiconductor industry and the intended partner during the exhibition. The customer on site expressed that they would purchase the ultrasonic CNC machine tool, and on April 5 signed the procurement contract and made a delivery ceremony.

Delivery Ceremony (from left to right: Conprofe Sales Manager in South Korea, Conprofe Senior Director of International Sales and Marketing, End User, Strategic Partner)

Conprofe awarded the First Prize of SEMI Product Innovation for the Ultrasonic Precision Engraving and Milling Machining Center ULM-600 from the International Semiconductor Industry Association in March this year. The product untangles challenges in semiconductor hard-brittle material machining, such as common cracks and poor surface quality, and ultra-deep micro-hole machining, effectively improving machining efficiency with better workpiece surface quality and longer tool life.

The International Semiconductor Industry Association

The First Prize of SEMI Product Innovation

On April 5, Conprofe signed the strategic cooperation framework contract with the Korea partner.

Signing the Contract

Currently, Conprofe sells well in Korea with Ultrasonic Machine Tools, Ultrasonic Machining System, Solid PCD Tools and other products, and maintains long-term close cooperation with multiple semiconductor manufacturers there. With SIMTOS 2024, Conprofe further strengthens the exchange with local customers and dealers, and also increases their awareness of our innovative products, technologies and solutions.

Conprofe is full of harvest in SIMTOS 2024. The high popularity of Conprofe booth proves once again that Conprofe Ultrasonic High-Efficiency Machining Solutions does boast its unique charm. And our innovative products and solutions are always for Korea semiconductor parts machining with better quality and efficiency!

Interested in Joining Our Agent Network or Becoming One of Us?

Contact: Ms. Esther Hu

Tel/WhatsApp/WeChat: +86- 138 2607 9999

Email: esther.hu@conprofetech.com

Web: www.conprofecnc.com