Visit Conprofe @SEMI-e | June 26-28, Shenzhen | Booth 8L23

Visit Conprofe @SEMI-e | June 26-28, Shenzhen | Booth 8L23

The 6th China International Semiconductor Technology & Application Expo

Date: June 26-28, 2024

Venue: Shenzhen International Exhibition & Convention Center (Bao’an District)

Booth: 8L23

Registration: https://wk2on8jstpbuwe95.mikecrm.com/MFanw3d

Conprofe will showcase its cutting-edge Ultrasonic Machine Tools and Solutions at SEMI-e Shenzhen, an authoritative exhibition in the Semiconductor Industry.

Onsite, you will learn more about Conprofe’s initiatives to tackle hard-to-cut material with its hybrid CNC solutions, including state-of-the-art ULTRASONIC CNC machines, Shrink-Fit and Hydraulic Tool Holders, Solid PCD Micro-Edge Cutting Tools and Solid PCD Micro-Drills.

Our professional sales consultants will present successful application cases to help you better understand our product features and benefits. If you wonder how we use an Ultrasonic CNC Machine to drill 1,000 D0.45mm*23mm (Depth-Diameter Ratio 55:1) blind holes in the superhard Single Silicon Carbide Showerhead without hole edge chipping or hole wall cutter marks, come and meet us at the booth!

Can’t wait to meet you at SEMI-e Conpshsrofe’s Booth No. 8L23 from June 26 to 28 in Shenzhen!

Contact: Ms. Esther Hu

Tel/WhatsApp/WeChat: +86- 138 2607 9999

Email: esther.hu@conprofetech.com

Web: www.conprofecnc.com