#Industry News
PanShiHaoHai Full-stack Liquid Cooling Solutions Break Heat Dissipation Bottlenecks for High-density Computing
13-90kW CDU Matrix, PUE 1.05-1.2: PanShiHaoHai Covers Every Density From Renovation to New Builds
PanShiHaoHai offers full-stack liquid cooling solutions to break heat dissipation bottlenecks for high-density computing. As AI training, agent reasoning and supercomputing push cabinet power density higher, cold plate liquid cooling emerges as the most reliable route, holding data center PUE between 1.05 and 1.2 with fully sealed coolant circulation. Its product matrix covers 13-30kW air-to-liquid CDUs for low-cost room renovation, 65-90kW liquid-to-liquid CDUs for high-density clusters, and 30kW RDHx rear doors solving instantaneous overheating, plus OEM/ODM services. An upgraded phase-change system handles chip-stacking extremes. EXTRCOOL provides dual-mode CDUs, manifolds, cold plates, rear-door heat exchangers, dry coolers and containerized units.