#Industry News
Liquid Cooling Becomes Core Driver for Next-gen High-density AI Data Center Construction
72 GPUs, 120kW, 10x Performance: How Liquid Cooling Made GB200 NVL72 the TCO Playbook
Liquid cooling has become the core driver for next-generation high-density AI data centers, where heat density exceeds 50 times standard offices and IT loads top 30MW. Despite the myth that it is new, liquid cooling dates to 1960s IBM mainframes; H100 racks cap at four air-cooled servers (41kW). The real driver is AI TCO optimization: GB200 NVL72's direct-to-chip cooling packs 72 GPUs into a 120kW rack with 10-fold Hopper performance. Liquid absorbs roughly 4,000 times more heat per unit volume, though around 15% of low-power components stay air-cooled. EXTRCOOL provides one-stop full liquid cooling solutions.