#Industry News
Cooling Manifold Becomes Core Bottleneck of Next-Gen AI Liquid Cooling Infrastructure
2000W Chips, 240kW Racks, USD 2.29B Market: Why Manifolds Are the New AI Supply Chain Battleground
At GTC 2026, NVIDIA's Jensen Huang declared the AI industry's large-scale production era, with single-chip power exceeding 2000W and air cooling phased out. The global manifold market is projected to reach USD 2.29 billion by 2030. Vera Rubin NVL72 racks exceed 240kW, with manifolds accounting for over 20% of liquid cooling hardware costs. NVIDIA's AVL/RVL dual certification creates an eight-supplier closed loop, where six mainland Chinese manufacturers hold 70% of global capacity. Readore—the only mainland supplier with dual certification—targets million-level annual capacity in 2026, while each Rubin rack requires 200-300 UQD/MQD connectors. EXTRCOOL provides one-stop full liquid cooling solutions.