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#Industry News

Liquid Cooling Becomes Essential Infrastructure for AI Computing Development

1400W GB300, 2500W Rubin, $30M Annual Savings: The Physics Making Liquid Cooling Irreplaceable

Liquid cooling has become essential infrastructure for AI computing as new-generation chips—GB300 above 1400W, Rubin over 2500W, Google TPU v7 at 980W—outstrip air cooling. It cuts PUE from over 1.4 to 1.05-1.1, saving a 10MW data center nearly $30 million in annual power costs. The market is projected at $16.5 billion with 59% CAGR, China leading growth. Upstream localization advances across coolant, quick connectors and cold plates, though high-end CDU pump valves remain import-dependent; cold plate dominates, while immersion supports 900kW racks below 1.04 PUE. Policy now mandates PUE and minimum liquid cooling penetration for new large data centers. EXTRCOOL provides one-stop full liquid cooling solutions.

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  • EXTRCOOL INDUSTRY LIMITED