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#Industry News

Liquid Cooling Becomes Standard Thermal Solution for High Power AI Racks

GB200 at 2700W, 1MW Racks by 2029: The Physics That Make Liquid Cooling the Only Option

Liquid cooling has become the standard thermal solution for high-power AI racks, with NVIDIA GB200 adopting full cold plate cooling and GB200 super chips reaching 2700W TDP; industry forecasts predict rack power density breaking 1MW by 2029, rendering air cooling obsolete as it wastes nearly forty percent of power on air conditioners. ZTE and Schneider data confirm liquid cooling cuts long-term power expenditure and overall CAPEX for 20-40kW racks. Three routes cover cold plate, immersion and spray, with cold plate dominating through single-phase L2A for retrofitted rooms and L2L for megawatt loads. EXTRCOOL provides one-stop liquid cooling solutions.

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  • Area 51, NV, USA
  • EXTRCOOL INDUSTRY LIMITED