#Industry News
Liquid Cooling Innovation Drives Thermal Upgrade for High-Density AI Data Centers
From $5.65B to $48.42B and 65% D2C Share: The Innovation Curve Reshaping AI Cooling
Liquid cooling innovation drives thermal upgrades for high-density AI data centers as NVIDIA's GB200 NVL72 racks reach 120-132kW TDP, rendering air cooling inadequate, while the global market grows from $5.65 billion in 2024 to $48.42 billion in 2034. Direct-to-chip cooling captures about 65% of high-density deployments with PUE of 1.10-1.25. In-row CDUs deliver centralized coolant distribution and flow isolation for 300kW+ clusters, industrial-grade units with redundant pumps support megawatt-level bases, and energy-saving CDUs apply dynamic flow matching for low-PUE green operation. EXTRCOOL provides one-stop liquid cooling solutions.