#Industry News
Liquid Cooling Evolving From Heat Dissipation Solution to Core AI Infrastructure
From RMB 18.4B to 130B by 2029: Why Liquid Cooling Is Now the Thermal Backbone of AI Infrastructure
Liquid cooling is transforming from an auxiliary heat dissipation method into core AI infrastructure, with NVIDIA GB200 NVL72 racks requiring 120kW cooling capacity making thermal management decisive for chip operation and cabinet layout. Cold plate systems attach heat exchangers close to heat sources while cutting fan and refrigeration energy. The industry chain value lies in full-link capability, with CDUs regulating flow, temperature and pressure as the thermal core. According to CAICT, China's intelligent computing center liquid cooling market grew from RMB 18.4 billion in 2024 to a forecast RMB 130 billion by 2029. Competition now centers on mass production capacity, customer certification and sustainable cash flow rather than conceptual speculation. EXTRCOOL provides one-stop liquid cooling solutions.