#Industry News
AI Data Center Thermal Management: Beyond Chip-Level Cooling to Full-System Liquid Cooling Evolution
Six Cascaded Links and a 132kW Cabinet: Why GB300 Pushes Thermal Design Beyond the Chip
AI data center thermal management has evolved beyond chip-level cooling into full-system liquid cooling, treating chip dissipation as merely the first link of a six-stage chain: chip heat generation, cold plate absorption, manifold distribution, distributed pump circulation, rack-level exchange and facility water loop discharge. NVIDIA's GB300 NVL72 marks a new era with 132kW per cabinet and independent single-chip cold plate layout—doubling quick connectors versus GB200's integrated design—demanding higher CDU flow precision and loop stability for 72 Blackwell GPUs and 36 Grace CPUs. Supermicro, ASUS, Wiwynn and Foxconn now ship customized full-liquid-cooled servers, with competitiveness defined by systematic cooling reconstruction rather than simple cold plate addition. EXTRCOOL provides one-stop liquid cooling solutions.
