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#Industry News

Three Liquid Cooling Solutions Break the Air-Cooling Limit for High-Density AI Data Centers

RDHx, Direct Chip and Immersion: Three Routes Beyond Air Cooling's 30-60kW Rack Ceiling

As AI and HPC workloads push rack power density from 5-10kW to 30kW, 50kW and beyond, air cooling has become inefficient and inadequate, making liquid cooling the mainstream solution that captures heat directly at the source. Three technologies dominate modern thermal management: rear door heat exchangers, ideal for incremental upgrades of legacy data centers; direct chip cooling that mounts cold plates on CPUs and GPUs to eliminate 70%-90% of rack heat at the source for ultra-high-density computing; and immersion cooling that submerges entire servers in dielectric fluid for extreme density and ultra-low energy consumption. EXTRCOOL provides one-stop liquid cooling solutions.

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  • Area 51, NV, USA
  • EXTRCOOL INDUSTRY LIMITED