#Industry News
Advanced Liquid-Cooling Technical Insights Shared at OCP Taiwan Summit
7W/mm² Hot Spots and a 4℃ ATD: AVC's Five-Challenge Roadmap for 45℃ Water Cooling
At the OCP Taiwan Summit, AVC Thermal R&D Vice President Fang-chou Lin outlined five core challenges for future liquid cooling: rising chip TDP, 45℃ high-temperature water cooling trends, stricter coolant cleanliness, lower CDU heat exchange temperature difference and the shift from component competition to full industrial chain integration. Advanced CoWoS and Chiplet packaging create localized hot spots approaching 7W/mm² that traditional cold plates cannot eliminate under 45℃ inlet water, while 80-100μm microchannels push CDU filtration standards from 50μm to 25μm. AVC's new-generation CDU adopts a 4℃ ATD design with a 70kW-to-2.6MW lineup, backed by vertical integration of fans, pumps, RPUs and cabinets. Remaining bottlenecks include unified TCS cleanliness standards and material durability against high-flow channel erosion. EXTRCOOL provides one-stop liquid cooling solutions."