#Industry News
AI High-Density Computing Drives Full Upgrading of Data Center HVAC and Liquid Cooling Systems
1800W Chips, PUE 1.3 Mandates and Four Cooling Layers: Why HVAC Became Data Center Core Competitiveness
NVIDIA's Vera Rubin architecture pushes single-chip TDP to 1800W and rack power density from 20kW to 70-132kW, far beyond air cooling's 40kW ceiling, while NDRC mandates maximum PUE of 1.3 for new large-scale data centers and Beijing's 2026 tiered electricity pricing targets facilities above 1.35. Modern HVAC spans four layers—magnetic-levitation chillers with IPLV above 10, terminals from CRAH to CDUs, and AI control—while DeepMind's algorithm cut cooling energy 40%. Liquid cooling becomes mandatory above 40kW, with plate cooling absorbing 60-80% of server heat, immersion supporting 100kW+ racks and hybrid air-liquid architectures the most practical route. EXTRCOOL provides one-stop liquid cooling solutions.