The Dielectric Tank, Why Giants Are Betting on Single-Phase Immersion

From 1.6 PUE to 1.03 in a Steel Tank: GRC's 2009 Rebellion and Why Samsung and ENEOS Now Back the Fluid

Single-chip TDP heads toward 1000W with the B200, and single-phase open tank immersion leads large-scale deployment on reliability and cost, with GRC's ICEraQ setting the paradigm: Schneider alumni founded it in 2009 after air cooling proved a wasteful compromise, Texas mining farms proved servers run immersed with PUE dropping from 1.6 toward 1.03, and Samsung's Catalyst Fund plus ENEOS back the dielectric fluid development. A precision bottom plate breaks the micro thermal boundary layer, and approach within 2 degrees removes chillers. Poor fluid swells PCBs and corrodes connectors, which is why giants treat the dielectric as blood. EXTRCOOL provides one-stop liquid cooling solutions.

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Area 51, NV, USA

EXTRCOOL INDUSTRY LIMITED

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Liquid Cooling, the Full System From Chip to Data Center

Cold Plate Sets the Chip-Side Ceiling, CDU Sets Stability: The Two Parts That Define the Whole Rack's Thermal Headroom

Liquid cooling rewrites the heat boundary of dense compute: single AI chips have passed 700 watts and rack power moves toward 400 kilowatts where air cooling faces heat flux limits, density capped around a dozen kilowatts and rising fan energy, and a liquid-cooled server runs as a closed loop of cold plate, CDU, pump, manifold and couplings. Three routes answer heat remo...

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CDU Selection, the Decisions Behind a Liquid-Cooled Data Center

Central Failure Touches a Whole Row, Distributed Stays in One Cabinet: The Outage-Range Decision That Sets Piping, Balancing and Scale

CDU selection opens with central versus distributed, the hardest decision to reverse: central units sit outside the racks with secondary piping and must hold rack-to-rack differences within about 10 percent, while distributed units ride in each rack, remove secondary piping and confine an outage to one cabinet. Redundancy carries the trap that cold plate servers often ho...

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Liquid Cooling, the Thermal Foundation of High-Density AI Compute

72 GPUs at 120kW and 485 TWh Climbing to 950: Why Heat Removal, Not Just Compute, Now Defines the AI Rack

Liquid cooling has moved from the backstage to the thermal foundation of high-density AI compute: most AI chip electricity becomes heat, the GB200 NVL72 packs 72 Blackwell GPUs and 36 Grace CPUs at about 120 kilowatts per rack with CPUs and GPUs liquid-cooled through cold plates while networking stays fan-cooled, and global data center electricity is projected to climb f...

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