EXTRCOOL's Fully Prefabricated Container, Productized Compute Infrastructure

300kW in a 45-Foot Cabin, Online in 72 Hours: Factory-Tested Compute That Arrives Delivered, Not Built

EXTRCOOL answers fast compute demand with a 45-foot fully prefabricated liquid cooling container data center: power distribution, compute, liquid cooling, automation and security integrate into one standard container with assembly, joint commissioning and full testing completed in the factory, and the site only connects water, electricity and network, reaching production in as fast as 72 hours with the deployment cycle cut by over 90%. The cabin carries 300kW supporting NVL72 GB300 and B300, with 7 by 24 cloud monitoring on the PLC. EXTRCOOL provides one-stop liquid cooling solutions.

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Area 51, NV, USA

EXTRCOOL INDUSTRY LIMITED

Associated Trend items

Liquid Cooling, the Full System From Chip to Data Center

Cold Plate Sets the Chip-Side Ceiling, CDU Sets Stability: The Two Parts That Define the Whole Rack's Thermal Headroom

Liquid cooling rewrites the heat boundary of dense compute: single AI chips have passed 700 watts and rack power moves toward 400 kilowatts where air cooling faces heat flux limits, density capped around a dozen kilowatts and rising fan energy, and a liquid-cooled server runs as a closed loop of cold plate, CDU, pump, manifold and couplings. Three routes answer heat remo...

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CDU Selection, the Decisions Behind a Liquid-Cooled Data Center

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CDU selection opens with central versus distributed, the hardest decision to reverse: central units sit outside the racks with secondary piping and must hold rack-to-rack differences within about 10 percent, while distributed units ride in each rack, remove secondary piping and confine an outage to one cabinet. Redundancy carries the trap that cold plate servers often ho...

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Liquid Cooling, the Thermal Foundation of High-Density AI Compute

72 GPUs at 120kW and 485 TWh Climbing to 950: Why Heat Removal, Not Just Compute, Now Defines the AI Rack

Liquid cooling has moved from the backstage to the thermal foundation of high-density AI compute: most AI chip electricity becomes heat, the GB200 NVL72 packs 72 Blackwell GPUs and 36 Grace CPUs at about 120 kilowatts per rack with CPUs and GPUs liquid-cooled through cold plates while networking stays fan-cooled, and global data center electricity is projected to climb f...

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