EXTRCOOL, Liquid Cooling Infrastructure for High-Density Compute

Micro-Modules, Dedicated Racks and Rear Door Coolers on One Cold Plate Line: EXTRCOOL's Four-Product Stack for High-Density Compute

EXTRCOOL supplies liquid cooling infrastructure for data centers and intelligent compute scenarios, covering new builds and existing room retrofits, with a product line built on the cold plate route: single and double-row liquid cooling micro-modules for high-density deployment and dedicated liquid cooling racks. Piping and key components are assembled in the factory, so on-site processing shrinks and the installation cycle shortens, while pumps, fans and power supplies carry backup capacity so a failure in one device does not take cooling down, and existing rooms keep their original infrastructure with the liquid cooling plan added on top. EXTRCOOL provides one-stop liquid cooling solutions.

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Area 51, NV, USA

EXTRCOOL INDUSTRY LIMITED

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Liquid Cooling, the Full System From Chip to Data Center

Cold Plate Sets the Chip-Side Ceiling, CDU Sets Stability: The Two Parts That Define the Whole Rack's Thermal Headroom

Liquid cooling rewrites the heat boundary of dense compute: single AI chips have passed 700 watts and rack power moves toward 400 kilowatts where air cooling faces heat flux limits, density capped around a dozen kilowatts and rising fan energy, and a liquid-cooled server runs as a closed loop of cold plate, CDU, pump, manifold and couplings. Three routes answer heat remo...

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CDU Selection, the Decisions Behind a Liquid-Cooled Data Center

Central Failure Touches a Whole Row, Distributed Stays in One Cabinet: The Outage-Range Decision That Sets Piping, Balancing and Scale

CDU selection opens with central versus distributed, the hardest decision to reverse: central units sit outside the racks with secondary piping and must hold rack-to-rack differences within about 10 percent, while distributed units ride in each rack, remove secondary piping and confine an outage to one cabinet. Redundancy carries the trap that cold plate servers often ho...

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Liquid Cooling, the Thermal Foundation of High-Density AI Compute

72 GPUs at 120kW and 485 TWh Climbing to 950: Why Heat Removal, Not Just Compute, Now Defines the AI Rack

Liquid cooling has moved from the backstage to the thermal foundation of high-density AI compute: most AI chip electricity becomes heat, the GB200 NVL72 packs 72 Blackwell GPUs and 36 Grace CPUs at about 120 kilowatts per rack with CPUs and GPUs liquid-cooled through cold plates while networking stays fan-cooled, and global data center electricity is projected to climb f...

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Products associated

modular micro datacenter

EXTRCOOL 20FT

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