#Industry News
AI Server Power Growth Pushes Liquid Cooling Beyond Air Cooling Limits
Cold Plate and CDU Hold Most of the Value, but Entry Counts Are Not Revenue: Interface Matching, Sampling and Volume Ramp Decide Who Supplies the Platform
AI server power keeps rising and air cooling delivers falling marginal benefit above a certain rack threshold, more airflow raising fan power, noise and floor space, so liquid cooling moves the heat-exchange interface to the chip cold plate and the air-liquid cooling CDU bridges the server loop to facility cooling. Cold plate stays the mainstream route covering a wide rack power range, GB200 NVL72 still uses it, while immersion supports higher density. Cold plate and CDU account for most of system value, and the competitive ground is heat transfer, flow control, filtration, redundancy and platform qualification, yield ramp and repeat orders rather than entry counts. Fluorinated fluids serve partial immersion and are not mandatory, with core incremental value on cold plates, CDUs, quick disconnects and piping. EXTRCOOL provides one-stop liquid cooling solutions.
