#Industry News
How Liquid Cooling Moves Heat From AI Chips to the Outdoors
Near-End Side, CDU and Outdoor Sink: How One Supply Pair Feeds Every Server and Dry-Break Valves Let a Rack Be Serviced Without Draining the Loop
GPU racks are getting denser and air cooling can no longer carry the heat away, so cold plate direct-to-chip cooling attaches a channeled metal plate to the chip, and the system splits into three sections, the near-end side inside the rack, the CDU exchanging heat between two loops through a plate exchanger, and the outdoor heat sink. A manifold works as the rack-level supply header and return collector, one CDU supply splitting into per-server branches and one return line, with dry-break self-sealing quick disconnects opening on mating and closing on disconnection so servers are replaced without draining the loop. Heat moves from GPU and CPU to cold plate, manifold, CDU secondary circuit, heat exchanger, primary circuit and ambient air. EXTRCOOL provides one-stop liquid cooling solutions.
