#Product Trends
3w UV laser marking machine for miconductor wafers
With small UV focus spot and the heat affected zone, the UV laser marking machine has high absorptivity to 355nm UV-light and is widely adapted to many materials.
Advantages:
1. High-performance ultraviolet laser and superior laser beam quality bring exquisite marking effect for customers;
2. The rotary table shortens the unit processing time. The benefits of customers grow exponentially in the same time;
3. Equipped with safety hood, it avoids physical injury of operators by mis-operation and minimizes the safety risk;
4. Good cooling performance, small size.
Application Area:
It''s widely used in special materials marking, cutting and processing. Such as all kinds of glass, LCD panel, textiles, chip ceramics, semiconductor wafers, IC grains, sapphires, polymer films, etc.
Tech Parameter:
Model
LSU3EI
Average Output Power
more than 3W@30KHZ
Wave Length
355nm
Marking Area
70×70mm/110×110mm (Optional)
Frequency
1-100KHz
Min Linear Width
0.01mm
Max Linear Speed
less than 7000mm/s
Power Supply
AC220V±15% 50Hz
