FDK Begins Sample Shipments of New Ultra-Compact Bluetooth® ver.6 Module "HY0025"

Sample shipments for overseas customers are scheduled to begin in January 2027

Tokyo, Japan - FDK Corporation (President: Hiroshi Shimozono, hereinafter "FDK") today announced the development of its new ultra-compact Bluetooth® Low Energy (hereinafter "Bluetooth LE") module, HY0025, the third product in its world's smallest-class Bluetooth LE module series, and will begin sample shipments to selected domestic customers in July. Sample shipments for general domestic customers and overseas customers are scheduled to begin in January 2027.

The HY0025, like the existing HY0020 and HY0021, is an ultra-compact Bluetooth LE module incorporating SASP™ technology developed by Toshiba Corporation. SASP technology enables the antenna to be formed on the shielded package on the top surface of the module. This eliminates the need for a large keep-out area around the antenna and achieves one of the smallest board-level occupied areas in the world. This product is an optimal solution for wirelessly transmitting data from a wide range of sensors in physical AI and healthcare applications.

The HY0025 is equipped with Nordic Semiconductor's nRF54L15 SoC compliant with Bluetooth ver.6. In addition to conventional Bluetooth LE communication, it supports long-range communication via Coded PHY and Channel Sounding, which enables highly accurate distance measurement between devices. These advanced features are expected to drive the creation of next-generation applications utilizing location and distance information.