MiniOven 04

The new MiniOven-04 is a compact and versatile IR reflow oven suitable for a wide range of SMD components. It provides smart features such as the integrated air recirculation, nitrogen support and the easy-to-use interface. Optimized air distribution allows heating the entire component perfectly even. Combined with nitrogen support, unwanted oxydation process will be reduced significantly. The benefits are obvious: ideal wetting behavior, increased surface tension and a much better long-time reliability.

The MiniOven-04 covers the whole temperature cycle for a defined reflow process of grid arrays (BGA, CSP) as well as QFN/MLF components. An intuitive display-based menu navigation makes getting familiar with the system a breeze. Editing the up to 99 reflow profiles will be a task as easy as can be. The included profile library provides a very convenient way to set process parameters for added chip carriers. Variable soaking times and target temperatures as well as individual offset and damping adjustment guarantee stable processes