Die Attach Force Measurement

Semiconductor chips are fragile devices prior to packaging and require delicate handing. During Through-Silicon Via (TSV), eutectic, epoxy, or solder based die attach processes, consistent force must be applied to the the chip.

Semiconductor chips are fragile devices prior to packaging and require delicate handing. During Through-Silicon Via (TSV), eutectic, epoxy, or solder based die attach processes, consistent force must be applied to the the chip. Incorrect force application causes broken chips and incomplete bonds. Load cells incorporated into the die attach tooling enables closed loop control during this delicate process.

How it Works

1. A LCM100 Miniature In Line Load Cell is between the pick and place head and armature.

2. As the armature presses the chip down onto the die during the attach process, the LCM100 measures the force applied.

3. The force applied is then displayed by IHH500 Intelligent Digital Hand Held Display or IPM650 Panel Mount Display.

4. Utilizing the IAA300 analog amplifier or the analog outputs from the IDA100 or IPM650, an amplified output can be sent to a PLC for automated die attach processes.

5. The ultra-low noise output from the IAA300 makes it ideal for high precision motion control.