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#Industry News

The latest technology of Hino Engineering

Using NXP's built-in ISP with various image sensors

We are currently developing a standard CPU module "MF-CPU-8M Plus" equipped with NXP's "i.MX8MPlus".

As a technology unique to Hino Engineering, which specializes in camera modules, we have achieved connection with various image sensors by making full use of the ISP mounted on the "i.MX8MPlus" and driver implementation for image sensors.

This eliminates the need for a separate ISP, enabling cost reduction and miniaturization of the board size.

Currently, driver development for several types of SONY sensors has already been completed, and the standard board is equipped with various I/Fs.

Of course, it is also possible to modify specifications (customization) to meet customer needs (*).

*A separate development fee will be charged.

The latest technology of Hino Engineering

Details

  • Tokyo, Japan
  • Hino Engineering, Inc.

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