BONDING ELECTRONIC COMPONENTS USING A FAST CURING ADHESIVES

Learn how we developed a fast curing epoxy for our customer

Customer’s Application

The customer wants to bond sensitive electronic components to a printed circuit board (PCB). The adhesion needs to be fast curing, dimensionally stable, withstand high temperatures and resist chemicals.

Application Discussion

In order to recommend the right solution, our technical expert needs to find out answers to certain questions pertaining to the customer’s application:

What is the bonding area?

What are the operating temperatures?

What chemicals does the adhesive need to withstand? How will the exposure take place? How long at a time and how many times will the adhesive be exposed to these chemicals?

What are the pot life and cure time requirements?

Product Recommendation

Based on answers to the above questions, Kohesi Bond’s technical expert recommended our product KB 1427 HT-3. KB 1427 HT-3 is a one component, heat curing epoxy system. It offers superior chemical resistance, dimensional stability and extremely low shrinkage upon cure. Additionally, it offers first-rate electrical insulation properties. The operating temperature ranges from -50°C to +200°C. Along with good thermal cycling resistance, this product can set-up in a few seconds and cures completely in 3-5 minutes at elevated temperatures. It offers first-rate mechanical strength properties and adheres superbly to PCB substrates. It offers a glass transition temperature (Tg) of > 120°C.

Our customer successfully tested KB 1427HT-3 in their application and got excellent results.