LPKF - Prototyping 3D Circuitry

LPKF ProtoPlate LDS

With ProtoPlate, LPKF closes a gap in prototyping three-dimensional molded interconnect devices. With laser direct structuring, a laser beam applies strip conductor structures onto a three-dimensional plastic component. Copper and other metal layers are then deposited on these structures in a currentless metallization process.

Creating Strip Conductors in a Beaker

The new ProtoPlate reduces the processing effort required for metallization considerably. Metallization of three- dimensional interconnect devices can now be carried out in your own laboratory without any appreciable chemical knowledge. The LPKF ProtoPlate basic package consists of an integrated processing cell with beaker, magnetic stirrer, temperature monitor and internal air filtering. The chemical consumables for the copper build-up are summarized in the LPKF ProtoPlate CU set.

As Easy as Making Coffee

Metallization is very easy: The clean structured components are immersed in the bath and metallization begins after a few minutes. Depending on the duration of the metallization process, uniform copper layers develop with a thickness of 3 μm to 10 μm on the plastic component. Finally, the LDS components are removed and rinsed.