OEM electronics – multichip modules

From customer inquiry to finished modules - Electronic modules for mission critical applications such as offshore, downhole and aerospace through conductive adhesive bonds for harsh applications with operating temperatures up to 200°C.

For the production of highly complex electronic assemblies we Micro-Hybrid are specialized in the development and series production of customer-specific multichip modules. Depending on customer requirements and operating conditions we use ceramic circuit carriers.

The assembly based on an adhesive application using the jet process avoided negative influences due to flux residues, for example. Reliability is thus increased, even under high temperature requirements of the electronics application. For high positioning accuracy by the bonding process we use bonding wires of only 20 µm diameter. In this way, Micro-Hybrid achieves a significantly higher degree of miniaturization.

From the development of the circuit layout to the introduction into the series process, we reliably implement all specifications. A high dynamic and flexibility of our engineering team enables a fast reaction to changing requirements. Order-related customer solutions can be implemented in an uncomplicated way.