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Experimental modal analysis of capped MEMS

Modal testing of silicon encapsulated MEMS and microstructures as a service

For comprehensive and representative analysis of capped MEMS, contact us. Our PolyXperts are looking forward to receiving your capped MEMS sample for modal testing, feasibility studies and consulting throughout all phases from development over prototyping to manufacturing of your encapsulated microstructures.

A comprehensive characterization of the MEMS device in its final and encapsulated state is crucial for a full understanding and quality control. As silicon is transparent in the near infrared spectra above wavelengths of 1050 nm, infrared-interferometer-based vibration measurement opens up the possibility for inspecting of encapsulated MEMS for authentic and most representative analysis results. Polytec’s brand new, patented state-of-the-art interferometer technology now delivers supreme data quality due to superior separation of individual device layers in the capped MEMS devices.

Laser-based measurement through Si encapsulation

Details

  • Polytecpl., 76337 Waldbronn, Germany
  • Polytec GmbH