A new BGA socket design uses high-performance elastomer capable of handling 75 GHz, low-inductance and wide temperature applications.
The GT-BGA-2127 socket is designed for a 40×40-mm package size and operates at bandwidths up to 75 GHz with less than 1 dB of insertion loss. The socket is designed to dissipate 150 W using a heat sink and an axial flow fan. The contact resistance is typically 30 mΩ/pin. The socket is mounted on the target PCB with no soldering and uses a small amount of real estate allowing capacitors/resistors to sit close by. Other passive components can be placed on the back side of the PCB by creating custom cutouts in the stiffener plate.
The socket is constructed with a spring-loaded shoulder screw which incorporates GT-BGA-2127a quick insertion method so ICs can be changed out quickly. To use, an operator places the device inside the socket, places the heat sink lid and applies downward pressure by turning four spring-loaded shoulder screws to a hard stop.
The GT-BGA-2127 socket is constructed with a high-performance and low-inductance elastomer contactor. The temperature range is -55 to +160°C. It works with ICs such as the 1596 BGA, 40×40 mm with 40×40 array and 0.92-mm pitch.
Pricing for the GT-BGA-2127 is $1,709 at qty 1 with reduced pricing available depending on the quantity required.