Infineon Technologies AG new 40nm generation of security chip solutions – the SLC3x – is based on a design concept that provides performance and scalability for a vast array of smart card applications and beyond. Smart card manufacturers and payment solution providers will benefit from a family architecture based on the de-facto industry standard Arm.
Supporting payment, identification and other applications, smart card solutions are increasingly transitioning to contactless, multifunctional technologies. They often also incorporate new biometric features to further facilitate user identification and make for a more convenient user experience. However, these new features and capabilities involve multiple stakeholders, adding implementation complexity and security challenges to the designs.
Infineon’s SLC3x series is the industry’s most advanced security controller portfolio. Right-fit members of the series support the full application spectrum, ranging from low-cost contact-based pre-paid and loyalty cards through standard dual-interface payment and identity cards to biometric system-on-card solutions and wearable devices – all compliant with the latest EMVCo specifications.
All SLC3x products are based on a high-performance, powerful and energy-efficient 32-bit ARM SecurCore SC300 dual-interface security cryptocontroller. This is enhanced by Infineon’s unique digital security technology as well as third-generation SOLID FLASH technology – of which more than seven billion chips have been sold to date.
Transaction speed and robust packaging are key success factors for contactless applications such as identification and transport ticketing, delivered through form factors such as wearables like key fobs and rings or through cards with biometric user authentication. With the SLC3x product family, Infineon enables contactless payment transaction times below 200 milliseconds even in scenarios with low reader field strengths or in combination with small antenna designs. In addition, highly robust and easy-to-integrate contactless or dual-interface packages such as Coil on Module support fast transition from contact-based to dual-interface solutions, while improving the performance and reliability of the final product.
Ready-to-use delivery forms such as small SPA modules with integrated ISO- and EMV-compliant antenna enable designers to deliver payment solutions in new form factors while reducing production timelines to a few weeks.
To further shorten time-to-market with smart card solutions, the new platform also offers innovative logistic concepts.
Qualification samples for immediate design-in activities and realization of a fast volume ramp-up are available.