Temporary Wafer Processing Adhesive

Thin wafer processing temporary bonding adhesive film for 3D wafer integration

AI Technology, Inc (AIT) announced its film format, high temperature, temporary wafer processing adhesive (WPA) for thin wafer processing of bonding device wafer to carrier wafer.

Temporary wafer bonding for thin wafer processing is one of the key technologies for wafer level 3D system integration.

This temporary wafer processing adhesive is a film from 5 to 80 microns for device wafer processing up to 450mm with and without topography. AIT high temperature capable WPA removes easily with laser assisted and solvent assisted release separation de-bonding as well as via traditional heat-sliding processes.

The temporary wafer processing adhesive is thermally stable to 320-330°C and the bonded compound wafers are compatible with standard WLP process equipment and for backside processing of 3D-TSV wafers. High integrity in bond strength enables easy back grinding to a thickness of 50 μm.

AIT’s thermally and chemically stable polymers can withstand multiple device wafer processes, such as dry etching, wet etching, CMP, PVD, solvent based spin coating of resists and polymers, lithography, electro plating and extended elevated temperature processing up to 320-330°C for at least 60 minutes under high vacuum.