ROHM, Mazda, and Imasen Sign a Joint Agreement to Develop Inverters

for e-Axle Using ROHM SiC Power Modules

ROHM has signed a joint development agreement with Mazda Motor Corporation (Mazda) and Imasen Electric Industrial Co., Ltd., (Imasen) for inverters and SiC power modules to be used in the electric drive units of electric vehicles, including e-Axle.

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47877 Willich, Germany

ROHM Semiconductor Europe

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ROHM and BASiC Semiconductor Form a Strategic Partnership

Contributing to the technical innovation of new energy vehicles through the development of automotive SiC power devices

Shenzhen BASiC Semiconductor and ROHM have entered into a strategic partnership agreement on SiC power devices for automotive applications. A signing ceremony was held at ROHM’s headquarters in Kyoto to commemorate the occasion. Under this agreement, the two companies will leverage their respective strengths to innovate and improve the performance of SiC power devices a...

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ROHM Develops Ultra-Low-Power On-Device Learning Edge AI Chip

AI at the edge enables real-time failure prediction without cloud server required

ROHM has developed an on-device learning AI chip (SoC with on-device learning AI accelerator) for edge computer endpoints in the IoT field. It utilizes artificial intelligence to predict failures (predictive failure detection) in electronic devices equipped with motors and sensors in real-time with ultra-low power consumption.

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ROHM’s New MOSFETs

Contributing to Higher Efficiency and Safer Operation with an Original Insulation Structure

ROHM has recently developed a compact, high efficiency 20V Nch MOSFET, RA1C030LD, optimized for switching in small, thin devices, including smartphones and wearables such as wireless earbuds and other hearable equipment.

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switching MOSFET module

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