New High-Performance Polyamide PA 6370

Maximum power for lower pressure molding applications

With PA 6370, Henkel is launching a high-performance material optimized for modern electronics and industrial applications. In combination with Schäfer’s machines and tools, it forms a perfectly coordinated solution for precise, safe, and durable encapsulation.

The polyamide-based hotmelt adhesive stands out with:

✅ Excellent flowability with low viscosity
✅ High resistance to moisture, heat, and corrosive influences
✅ Excellent electrical insulation & UL94 V-0 flame retardancy

Ideal for applications such as fan motors, charging stations, sensors, connectors, and cables – wherever reliability is critical.

Is the PA 6370 suitable for your applications?
We can advise you on selecting the right material.