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#Product Trends

Accelerating Device Bring-Up and Production Ramp for WLCSP 5G Mobile IC’s

As mobile phone electronics continue to shrink, WLCSP has become the de-facto packaging solution for IC’s going into today’s flagship handsets.

To keep up with the dramatic progress in mobile phone development, chip suppliers must bring up new silicon quickly, predictably, and at the lowest costs possible. A variety of test setup challenges must be overcome in order to ramp a WLCSP device into high volume on schedule. The probe head required to connect a WCLSP device to the ATE can be a critical link. Any delays caused by readiness of the probe head to support characterization, debug, or production release of the chip and its test program can be disastrous for a supplier in this space.

Details

  • Milpitas, CA 95035, USA
  • Rick Marshall