On Demand Webinar Available

Advanced Thermal Management for High-Power IC Test

n this Webinar, Smiths Interconnect experts describe state-of-the art of Thermal Management Solutions applied to advanced digital processor IC devices. Special attention will be given to the emerging SiP and large BGA package challenges facing the industry.

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Stuart, FL, USA

Rick Marshall

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Electrophysiology and imaging market trends Part 2

This is part 2 of the "Electrophysiology and imaging market trends" Podcast episode in which Justin Fry, Senior Product Line Manager for the medical market and Daniel Riveros Principal Engineer for medical as well will talk about MRI and connectivity challenges and opportunities. MRI is an imaging modality that uses magnetic fields to produce detailed images of soft tiss...

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C Series Product Configurator Now Available

2d/3D Configuration for EMC Metallic Circular Connectors

C Series, featuring Hypertac Hyperboloid technology, is an IP67 circular connector with an EMC metal housing. The C Series connectors have a compact size and feature gold plated contacts. They provide superior resistance to high levels of shock and vibration in rail and industrial applications.

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LSH Series Configurator Now Available

Configure Your Next High Power Rack and Panel Connector

The LSH rack and panel high power connector series from Smiths Interconnect is utilized across many different market segments including aerospace, automotive, industrial, test and measurement, and mass transit. The foundation upon which the LSH is built is the leading-edge Hypertac® hyperboloid contact technology.

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DaVinci 45G

manual test socket

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