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#Industry News

Smiths Interconnect announces today its new Galileo test socket for Area Array and Peripheral Package Test.

Quick-Delivery Galileo Test Socket for Rapid Device Bring Up, Characterization, and Failure Analysis

Galileo is an innovative, low-profile test socket engineered to support today’s high performance Digital and RF applications. It leverages proven interposer elastomer technology and advanced 3D printing manufacturing to provide a high-performance solution for BGA, LGA, QFP, SOIC, or QFN packaged devices with extremely short lead times.

Details

  • Genoa, Metropolitan City of Genoa, Italy
  • Roberta Rebora