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#Product Trends

New Kelvin Test Probes

Introduction of an innovative spring probe contact technology for Kelvin test of packaged devices down to 0.35mm pitch

The product’s unique beveled tip provides reliable, stable contact resistance for applications where chip test is critical, such as IoT, Mobile, Internet, and Automotive. Designed into Standard Array test sockets or Volta WLCSP probe heads, Smiths Interconnect’s Kelvin probes provide a robust, low maintenance, long life test solution.

Details

  • Shanghai, China
  • Susan Su