video corpo

Optimizing Production Test of QFN-packaged IC’s for Consumer, Automotive, Industrial Applications

Smiths Interconnect
Add to favorites

Featuring Joule 20 high frequency test socket.

Where best-in-class electrical requirements intersect with a need for a small outline, low-profile footprint, IC designers are increasingly migrating to QFN packages. With their direct-attach peripheral pad structures, large ground block for thermal and electrical performance, and very thin stack height, QFN packages offer myriad advantages, but bring a new set of testing challenges. Meeting these testing challenges requires a test socket solution that is robust, reliable, and electrically “clean.”

Optimizing Production Test of QFN-packaged IC’s for Consumer, Automotive, Industrial Applications

Associated Trend items