#Industry News
On Demand Webinar
Can AI predict its own reliability? Reliability testing next gen SoC's
In this webinar, we will explore the segment trends for next-generation AI Accelerator Processor Units (APUs) and Tensor Processing Units (TPUs). We’ll provide an overview of the market, highlighting segment growth and its impact on the semiconductor industry as a whole.
Additionally, we will examine the manufacturing challenges that significantly affect product performance during reliability testing of these devices. As many System-on-Chip (SoC) devices have expanded from 9,000 input/output channels and a thermal design power (TDP) of 850W to customer roadmaps indicating 12,000 I/O channels and TDPs exceeding 1,500W, the increased size and complexity present new challenges.
