Smiths Interconnect launches ‘DaVinci Gen V’ next-generation test socket

Delivers ultra-reliable testing of chips used in AI, 6G communications, and advanced computing applications

Smiths Interconnect today announced the launch of DaVinci Gen V, the latest flagship product in its DaVinci series portfolio. The product rigorously tests semiconductor chips during the manufacturing process to ensure they provide ultra-reliable and repeatable performance. This is important because these chips are used in a range of areas essential to everyday life, including AI accelerators, automotive systems and next generation 6G communications networks, that are set for global roll out over the next few years.

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Smiths Interconnect launches ‘DaVinci Gen V’ next-generation test socket

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Kansas City, MO, USA

Smiths Interconnect

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Smiths Interconnect launches ‘DaVinci Gen V’ next-generation test socket

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