All-Electric dot adhesive application revolutionizes the bag manufacturing industry by reducing adhesive usage.

Valco Melton
Add to favorites

Valco Melton’s EcoStitch all-electric applicator improves bond strength while saving up to 70% adhesive usage and reducing downtime.

For countless years, the paper bag manufacturing machinery has been utilizing pneumatic hot melt dispensing equipment for patch handle attachment until the recent emergence of the all-electric technology. Valco Melton’s EcoStitch applicator incorporates an innovative gluing technology, applicable to handle patch formation and attachment, bottom paste and bottom patch reinforcement, and bag seam gluing.

The benefits that EcoStitch all-electric technology brings to bag manufacture are almost endless. By focusing on the client, all-electric systems improve the OEE (Overall Equipment Effectiveness) by reducing adhesive usage, downtime and consumable parts, giving bag producers a direct competitive advantage over their rivals.

Historically, manufacturers have used compressed air (pneumatic systems) because it was easily available and satisfied the original design criteria established by early hot melt systems. Nevertheless, these pneumatic systems have had several long-term issues including constant and costly parts replacement, diminishing solenoid performance and use dynamic seals which are at the heart of system performance inefficiency. Electric gear pumps and electric valves require almost 90% less seals and spare parts to run, when compared to pneumatic pumps and valves. By eliminating the number of moving parts, all-electric systems eliminate the chance of failure, caused by worn out or imperfect seals.

Further, it is in regards to adhesive consumption that sets EcoStitch apart from all other gluing methods. Its new glue dots pattern application, configurable by the customer for every product requirement, allows from 40 to 70% in adhesive savings. In most frequent cases, this guarantees complete payback in as little as 4 months

Bond strength is also benefited by a dot and gap pattern. In an adhesive bead pattern, only the bead ends provide a high bond. However, EcoStitch dots, while putting down less adhesive, provide more bonding surface area and more independent bonds with focused fiber penetration. Every dot flatten out 360-degrees with compression providing more bonding surface area while maintaining heat penetration. Valco Melton’s solution has passed each and every strength test developed by the most strict customers - an evidence of reliability.

Sustainability continues to be a key fact in package design and equipment design. As the packaging industry feels pressure to reduce its overall carbon footprint, all electric systems offer an attractive solution toward fulfilling these goals. In recognition of Valco Melton’s commitment with ecological values, EcoStitch technology has been nominated for the Sustainability Awards 2019 due its proved environmental benefits reducing adhesive usage.

: EcoStitch dots, while putting down less adhesive, provide more bonding surface.
: EcoStitch dots, while putting down less adhesive, provide more bonding surface.

Associated Trend items