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XEBEC Brush for Deburring and Polishing: Applications in Semiconductor Industry

Automated deburring/finishing process to improve efficiency

The demand of semiconductors is increasing especially in cloud computing and storage as working from home becomes more common than ever. The followings are some examples of XEBEC Brush used in the semiconductor industry for deburring and polishing.

1. Semiconductor component

XEBEC Brush Wheel Type is ideal for deburring and polishing screw threads. It is used on a cover of a semiconductor component to remove rust and burrs on screws. Deburring used to be done manually, but now automated deburring is achieved.

Tool: W-A11-75

Machine: Machining center

Material: Nickel alloy

2. Vacuum equipment part

XEBEC Brush Surface (φ6) is ideal for deburring and polishing O-ring grooves. It is used to remove cutter marks in O-ring groove on a vacuum equipment part, which is used for manufacturing IC chips inside semiconductor devices.

Previously, polishing after cutting was done by hand. It resulted in uneven cutter mark removal per workpiece, making it difficult to standardize the surface polishing process.

However, by automating the polishing process after cutting with XEBEC Brush, the surface polishing is standardized, and drastically shortened the work time.

Tool: A11-CB06M

Material: Aluminum

O-ring deburring and polishing with XEBEC Brush

Details

  • Japan, 〒102-0083 Tokyo, Chiyoda City, Kōjimachi, 1-chōme−7−25
  • XEBEC TECHNOLOGY

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