#Industry News
Thermal lock-in inspection of semiconductor devices with Xenics XCO camera module
Thermal lock-in: Semiconductor Device Analysis
Thermal imaging can be a very powerful tool for semiconductor failure analysis. Current leakage defects typically generate thermal hot-spots: metal short circuits, latch-up, junction defects in diodes and transistors, breakdown of MOS gate oxide, ESD failures, etc. When using conventional thermography or thermal imaging on semiconductor devices, we are faced with two problems:
- Intensity variations caused by differences in emissivity of the various materials;
- Thermal hot spot dilation – heat will spread out from defect location.
To learn how the Xenics XCO camera module can help in these issues, click the link to read more.