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Pressureless Sintered Aluminum Nitride and Hot Press Sintered Aluminum Nitride

Pressureless Sintered Aluminum Nitride and Hot Press Sintered Aluminum Nitride

Aluminum nitride (AlN) is the best material to use if high thermal conductivity and electrical insulation properties are required. Due to its thermal expansion coefficient close to silicon and excellent plasma resistance, it can be used to manufacture semiconductor processing equipment and medical equipment parts.

Features of Aluminum Nitride (ALN):

1. High thermal conductivity.

Its thermal conductivity is nearly 7 times higher than alumina ceramics.

2. High electrical insulation

3. High Strength

4. Corrosion resistance

5. Halogen plasma resistance

6. Low thermal expansion, close to the thermal expansion coefficient of silicon

Details

  • Xiang'an District, Xiamen, Fujian, China
  • INNOVACERA

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