Application of aluminum nitride substrate

Application of aluminum nitride substrate

Aluminum nitride products are attracting more and more attention as a new generation of high thermal conductivity materials due to their superior thermal conductivity, high insulation, and thermal expansion rate close to silicon.

Features:

High thermal conductivity: about 7 times the thermal conductivity of alumina

Thermal expansion rate: thermal expansion is close to silicon, and the reliability of the mounting of large silicon wafers and heat-resistant cycles

Electrical characteristics: high insulation, low dielectric coefficient

Mechanical properties: superior to the mechanical properties of alumina

Corrosion resistance: stronger than molten metal corrosion resistance

Purity: low impurity content, non-toxic, high purity

Application:

High-power transistor module substrate

High-frequency device substrate

Heat-radiating insulation board for turn module

Fixed substrate for semiconductor laser and light-emitting diode

Hybrid integrated module, the ignition device module

IC package

Thermal module substrate

Some products for semiconductor production equipment